Macro view of an iridescent silicon microchip grid

From your designto working silicon.

A faster path from finished design to packaged silicon. Around 6 months, at roughly one fifth of the usual cost, with no in-house chip team.

Talk through your chip See how it works

Making new chips should not cost millions.

$1M+can go before working parts

The whole route is expensive

Tools, sign-off, masks, fabrication, packaging and test can push a standalone program past $1M.

18months on average to first silicon

The route is slow

Access, contracts, sign-off, shuttle timing, fabrication and packaging turn one tape-out into a long program.

86%do not reach production on first silicon

First silicon rarely finishes the job

Only 14% of IC/ASIC projects achieved first-silicon success in a 2024 industry study.

Your chips in ~6 months.At ~5× lower cost.

For qualified designs, our fast channel shares the wafer and manages the complete manufacturing route from design handoff to packaged parts.

Cost benchmarkRoughly one fifthCompared with a standalone low-volume route for a qualified design.

Fast-channel scope180 nm to 40 nmBuilt around scheduled MPW runs, available PDKs and a tape-out-ready design.

Delivered outputPackaged partsReady for bring-up, with full production test coming.

You bring the design.We own the route to silicon.

01Day one

Design review

We review your GDS, target node, die size, interfaces, packaging needs and production goals to confirm the right route.

02Before tape-out

Sign-off

Once the route is set, we run DRC, LVS and timing checks before your design goes near a wafer.

03Wafer booked

Shared wafer

Your design rides with others. You pay for a slot, not a full mask set.

04Parts delivered

Delivered

You receive packaged parts, ready for bring-up. Full test is coming.

Engineers working with semiconductor fabrication equipment in a cleanroom

The chip route without a chip operations team.

Your engineers keep building the product. Mozaic handles the manufacturing work that normally needs dedicated silicon operations.

01 No foundry contracts to negotiate
02 No PDK and EDA stack to assemble
03 No packaging vendors to coordinate
04 One technical owner when dates change
05 A repeatable route for the next run

Built for demanding
applications.

Real NVIDIA DGX Spark AI computer — AI and advanced compute

Real IBM Quantum System One installed at the Fraunhofer research institute — Quantum, photonics and RF

Real optical sensor array installed on a research robot — Sensors, MEMS and medical

Drone flying above a mountain landscape — Industrial, space and defense

For teams building specialized silicon on mature and mid-range nodes from 180 nm to 40 nm.

30 minute feasibility call

Let’s see if your chip fits.

Bring your design stage, target node and quantity. Leave with a realistic route, cost range and next step.

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